No Headphone Jack on iPhone 7 Pro -- Japanese Mag
Staff ReporterApple's WWDC is coming soon, but iPhone 7 and iPhone 7 Plus will definitely not be unleashed at this event. Apple fans have to wait until this fall. However, as the time near, rumors are ramping up.
Japanese site Mac Otakara Wednesday shared images, first released on the Japanese magazine MacFan, which seemly confirm rumors that the next generation iPhone will use largely the same design as its predecessor--iPhone 6s and 6s Plus.
The magazine detailed schematics of the 5.5-inch 'iPhone 7 Pro':
--Size will be 158.22 x 77.94 x 7.3 mm
--Dual lenses will be introduced to iSight camera
--Headphone jack will be removed, with headphones instead connecting via Lightning or Bluetooth
Schematics from the Japanese magazine are in line with previous rumors, including " iPhone 7 thickness is likely to approach iPod Touch""the iPhone 7 and 7 Plus will not be significantly thinner".
As per a new report issued by KGI Securities analyst Ming-Chi Kuo, "iPhone 7" could be Apple's thinnest smartphone yet, with a thickness between 6.0mm and 6.5mm.
"The schematic shows Apple does indeed look set to go through with its risky plan to axe the technology sector's oldest universal standard," said Forbes.
According to an article published by BGR, Apple iPhone 7's Smart Connector might be used for wireless charging, "it could open the door for some exciting new accessories for the next-generation iPhones."
MacFan provided precise design details of the iPhone 6/6 Plus and 12.9-inch iPad Pro ahead of launch. The magazine might win the lottery again.
Previous rumors said iPhone 7 will sport a 4.7-inch LCD display, A10 chip, a 2GB/3GB RAM, a dual camera with OIS (optical image stabilization) feature, and a touch-sensitive home button.
Other Rumors also suggested the next generation iPhone will be both fully waterproof and dustproof.
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